Abstract:
<div>The aim of this work is to analyze the phase composition, microstructure, and thermal behavior of Sn-3.0Ag-0.5Cu solders with (0.1, 0.4, 1, 4) wt% Ni addition using experimental techniques (scanning electron microscopy, energy-dispersive X-ray spectroscopy, X-ray diffraction, differential scanning calorimetry) and computational thermodynamics (Thermo-Calc). The results show that the microstructure of all samples consisted of β-Sn dendrites in eutectic matrix (β-Sn + Ag3Sn) and elongated particles of Cu6Sn5 intermetallic phase. [..]
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