from the conferences organized by TANGER Ltd.
Attempt to determine the heat flow kinetics in insulating moulding sand with aluminosilicate microspheres matrix in order to identify and modify its properties. Destination of moulding sand is pouring thin-walled skeletal casting 3D, characterized by strongly developed surface of heat dissipation and 1.5 ÷ 3 mm predicted connector thickness. It will be shown the results of computer simulation of temperature field in the mould. For the implementation of the research it was used the eutectic aluminum alloy with silicon (AlSi12). The results of the heat flow in the cast-mould system using experimental casting typically for thermal derivative gradient analysis (TDGA) are shown. The method was developed in the Department of Foundry of Silesian University of Technology. For the purpose of the own research the methodology has been modified by location most of the thermocouple not in the cast, but in the moulding sand. Thermocouples were placed in established and variable distances in the range of 0 to 8 mm from the surface of the casting. One of the thermocouple was placed in the geometric centre of the casting. Simulation study was performed, which aim was precision analysis of heat flow in the mould. This analysis is the basis for the designation of thermophysical and technological parameters of mould or core sand. The aim is to estimate the thermophysical of technology quantity in actual industrial environments. Application of the concept of TDGA methods in the assumption should allow obtain quickly the information about thermal properties of mould without uses of complex thermal laboratory research. It was assumed that the analysis of the temperature field gives the qualitatively comparable results to the standard determining of thermal properties in a function of temperature. Despite the simplifications, the importance of technological methods may prove to be attractive in the production conditions of a typical foundry.
Keywords: Aluminosilicate microspheres, moulding sand, heat flow, TDGA© This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.