HIGH ASPECT RATIO PARYLENE C MICROPILLARS FORMED BY MOLDING AND ION-BEAM ETCHING METHOD

1,2 FOHLEROVA Zdenka
Co-authors:
2 FECKO Peter 1,2 GABLECH Imrich 2 KOSELOVA Zuzana
Institutions:
1 Central European Institute of Technology, Brno, Czech Republic, EU, zdenka.fohlerova@ceitec.vutbr.cz
2 University of Technology, Faculty of Electrical Engineering and Communication, Brno, Czech Republic, EU
Conference:
13th International Conference on Nanomaterials - Research & Application, Orea Congress Hotel Brno, Czech Republic, EU, October 20 - 22, 2021
Proceedings:
Proceedings 13th International Conference on Nanomaterials - Research & Application
Pages:
286-289
ISBN:
978-80-88365-00-6
ISSN:
2694-930X
Published:
22nd November 2021
Proceedings of the conference were published in Scopus.
Metrics:
599 views / 380 downloads
Abstract

This paper represents the molding and plasma etching method for developing a high aspect ratio parylene C pillar array. The silicon mold was fabricated using the modified Bosch process. The parylene was deposited by chemical vapor deposition into the silicone holes, followed by the etching of silicon to obtain the transparent membrane of hollow parylene C pillars. The etching method was initialized by transferring the pattern on the hard titanium mask via standard photolithography, followed by titanium etching. The oxygen plasma ionmilling of parylene C produced the flexible pillars standing on the silicon substrate. Both pillar arrays were characterized by scanning electron microscopy. Arrays of micropillars could be applicable for measuring cellular forces or as the bioinspired platform with modulated surface chemistry.

Keywords: Parylene C, micropillars, molding, etching

© This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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